Porous carbide mold for semiconductor molding
Semiconductor mold die equipped with a film adhesion mechanism.
A mold for semiconductor package sealing using porous cemented carbide equipped with an adsorption mechanism that ensures suction performance across the entire surface. It can achieve stable suction power, and due to its high porosity per unit area, it is expected to suppress the decrease in suction power caused by the accumulation of volatile components. Additionally, since suction is possible even in the corner areas of the cavity, it can prevent the occurrence of voids in those areas, significantly contributing to improvements in productivity and quality. 【Features】 ■ Avoids the occurrence of voids and greatly improves molding accuracy ■ Dramatically enhances productivity and speeds up supply *For more details, please download the PDF or feel free to contact us.
- Company：カナック
- Price：Other
